features * plastic package has underwriters laboratory flammability classification 94v-0 * high temperature metallurgically bonded construction * cavity-free glass passivated junction * capable of meeting environmental standards of mil-s-19500 * typical ir less than 1.0 a * high temperature soldering guaranteed: 260 c/10 seconds mechanical data case : jedec sod123-fl/mini sma, molded plastic over glass die we declare that the material of product is terminals : tin plated, solderable per haloggen free (green epoxy compound) mil-std-750, method 2026 polarity : color band denotes cathode end mounting position : any weight : 0.0155 g handling precautin :none electrical characteristic 1.maximum & thermal characteristics ratings at 25 c ambient temperature unless otherwise specified. parameter symbol symbol sod f151t- sh sod f152t- sh sod f153t- sh sod f154t- sh sod f155t- sh sod f156t- sh sod f157t- sh unit device marking code g1t g2t g3t g4t g5t g6t g7t maximum repetitive peak reverse voltage v rrm 50 100 200 400 600 800 1000 v maximum rms voltage v rms 35 70 140 280 420 560 700 v maximum dc blocking voltage v dc 50 100 200 400 600 800 1000 v maximum average forward rectified current lead length at t a = 75 c(note 2) i f(av) a peak forward surge current 8.3ms single half sine- wave superimposed on rated load (jedec method) i fsm a typical reverse recovery time (note 1) trr 150 ns typical thermal resistance (note 1) r j a r j c c/w operating junction temperature range t j c storage temperature range t stg c electrical characteristics ratings at 25 c ambient temperature unless otherwise specified. parameter symbol symbol sod f151t- sh sod f152t- sh sod f153t- sh sod f154t- sh sod f155t- sh sod f156t- sh sod f157t- sh unit maximum instantaneous forward voltage at 1.5a v f v maximum dc reverse current at rated dc blocking voltage t a = 25 tj = 100 i r a typical junction capacitance at 4.0v, 1mhz (note 2) c j pf notes: 1. i f = 0.5a, i r = 1.0a, i rr = 0.25a 2. 8.0mm 2 (.013mm thick) land areas sodf151t-sh thru sodf157t-sh surface mount glass passivated junction fast recovery rectifiers reverse voltage 50 to 1000v forward current 1.5a 1.5 110 40 C 55 to +150 50 100 160 C 65 to +175 15.0 1.3 5.0 100
2. characteristic curves ( ta = 25 c unless otherwise noted ) sodf151t-sh thru sodf157t-sh fig. 1 C forward current derating curve fig. 2 C maximum non-repetitive peak forward surge current fig 4. C typical reverse characteristics fig 3. C typical instantaneous forward characteristics fig 5. C typical transient thermal impedance fig 6. C typical junction capacitance average forward rectified current (a) average forward rectified current (a) instantaneous forward current (a) instantaneous reverse current ( a) junction capacitance (pf) 0 25 50 75 100 125 150 175 1 10 100 0.6 0.8 1.0 1.2 1.4 1.6 0 20 40 60 80 100 0.1 1 10 100 100 10 1.0 100 10 1.0 0.1 0.01 1.0 0.1 0.01 0.001 10 1.5 0.75 0 50 25 0 60 hz resistive or inductive load 0.375" (9.5mm) lead length tj = tj max 8.3ms single half sine-wave (jedec method) tj = 25 c pulse width = 300 s 1% duty cycle tj = 25 c f = 1.0 mhz vsig = 50mvp-p ambient temperature, c number of cycles at 60hz instantaneous forward voltage percent of rated peak reverse voltage (%) reverse voltage (v) tj=125 tj=75 tj=25 transient thermal impedance( c/w) 10 1.0 0.1 100 0.01 0.1 1.0 10 100 t,pulse duration,sec
3. dimension: suggested solder pad layout dimensions in inches and (millimeters) sodf151t-sh thru sodf157t-sh sod123-fl min max min max a 3.5 3.9 0.138 0.159 b 0.75 0.95 0.029 0.037 c 2.6 3.0 0.103 0.119 d 1.6 2.0 0.063 0.079 e h 0.9 1.2 0.036 0.047 j 0.12 0.22 0.005 0.009 k dim millimeters inches 0.45typ 0.018typ 0.8typ 0.032typ package a b c sod123-fl 0.044(1.10 0.040(1.00) 0.079(2.00)
4.packing information unit mm sodf151t-sh thru sodf157t-sh a 0.1 2.00 b 0.1 3.85 c 0.1 1.10 d 0.1 1.50 d 2.0 - d 1 min - d 2.0 178.00 d 1 min 62.00 d 2 0.5 13.00 e 0.1 1.75 f 0.1 3.50 p 0.1 4.00 p 0 0.1 4.00 p 1 0.1 2.00 t 0.1 0.23 w 0.3 8.00 w 1 1.0 11.40 sod123-fl carrier length carrier depth sprocket hole item symbol tolerance carrier width punch hole pitch spocket hole pitch 7" reel inner diameter feed hole diameter sprocket hole position 13" reel outside diameter 13" reel inner diameter 7" reel outside diameter embossment center overall tape thickness tape width reel width punch hole position
reel packing 5.suggested thermal profile for soldering process 1. storage environment temperature=5~40 humidity=55 25% 2. reflow soldering of surface-mount device 3. reflow soldering sodf151t-sh thru sodf157t-sh sod123-fl 7" 3,000 4.0 30,000 183*183*123 178 382*262*387 240,000 8.7 package reel size reel (pcs) component spacing (mm) box (pcs) appox. gross weight (kg) inner box (mm) reel dia. (mm) carton size (mm) carton (pcs) time 25 to peak temperature <6minutes time maintained above: - temperature (t l ) - time(t l ) profile feature soldering condition average ramp-up rate(t l to t p ) <3 /sec preheat - temperature min(tsmin) - temperature max(tsmax) - time(min to max)(t s ) 150 200 60~120sec tsmax to t l - ramp-up rate <3sec 217 60-260sec peak temperature(t p ) 255 -0/+5 time within 5 of actual peak temperature(t p ) 10~30sec ramp-down rate <6 /sec
6.high reliability test capabilities sodf151t-sh thru sodf157t-sh solder resistance mil-std-750d method-2031 solderability at 245 5 for 5 sec mil-std-202f method-208 high temperature reverse bias v r =80% rate at t j =150 for 168hrs mil-std-750d method-1038 forward operation life mil-std-750d method-1027 intermittent operation life mil-std-750d method-1036 pressure cooker 15p sig at t a =121 for 4hrs jesd22-a102 temperature cycling mil-std-750d method-1051 thermal shock mil-std-750d method-1056 forward surge mil-std-750d method-4066-2 humidity at t a =85 r h =85% for 1000hrs mil-std-750d method-1021 high temperature storage life at 175 for 1000hrs mil-std-750d method-1031 -55 to +125 dwelled for 30 min. and transferred for 5min. total 10 cycles 0 for 5min. rise to 100 for 5min. total 10 cycles 8.3ms single half sine-wave superimposed on rated load,one surge item test condition reference at 260 5 for 10 2sec immerse body into solder 1/16" 1/32" rated average rectifier current t a =25 for 500hrs t a =25 i f =i o on state:power on for 5 min. off state:power off for 5 min. on and off for 500 cycles
7. update record 1 ? ? 2013.03.20 sodf151t-sh thru sodf157t-sh ??
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